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Devcon HP 250 Epoxy, 50 mL , Dev-Pak, Straw

Item # ORS 230-14315 by Devcon (Mfg. Part # 230-14315, UPC # 78143143151)

$20.15 Each
Order 5+ and save $0.40 Each

High-performance, gap-filling thixotropic paste for structural bonding applications. Superior toughness, impact and chemical resistant. Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics. Excellent gap fill.

  • Quantity : 1 Each
  • Adhesive Tensile Shear : 3,200 psi
  • Applicable Materials : Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
  • Applications : Multi-Purpose
  • Base Type : Epoxy
  • Capacity Vol. : 50 mL
  • Chemical Compound : Epoxy
  • Color : Straw
  • Container Size : 50 mL
  • Dielectric Strength : 490 V/mil
  • Elongation : 25%
  • Fix Cure Time @ Temp. : 6 h @ 72 °F
  • Full Cure Time @ Temp. : 7 d @ 72 °F
  • Hardness : 78 Shore D
  • Height : 3 1/4 in
  • Length : 7 1/4 in
  • Material : Thixotropic Paste
  • Odor/Scent : Low
  • Packing Type : Dev-Pak™
  • Physical Form : Solid
  • Ratio : 2:1
  • Usage : Structural Bonding
  • Viscosity : 105,000 cP
  • Vol. : 50 mL
  • Width : 6 in
  • Working Time : 65 min