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Devcon HP 250 Epoxy, 400 mL , Cartridge, Straw

Item # ORS 230-14415 by Devcon (Mfg. Part # 230-14415)

$850.76 / Case
Order 5+ and save $17.02 Per Case
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High-performance, gap-filling thixotropic paste for structural bonding applications. Superior toughness, impact and chemical resistant. Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics. Excellent gap fill.

  • Quantity : 12 per Case
  • Adhesive Tensile Shear : 3,200 psi
  • Applicable Materials : Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
  • Application Temp. Range [Max] : 250 °F
  • Application Temp. Range [Min] : -67°F
  • Applications : Multi-Purpose
  • Base Type : Epoxy
  • Capacity Vol. : 400 mL
  • Chemical Compound : Epoxy
  • Color : Straw
  • Container Size : 400 mL
  • Dielectric Strength : 490 V/mil
  • Elongation : 25%
  • Fix Cure Time @ Temp. : 6 h @ 72°F
  • Flash Point : 200°F
  • Full Cure Time @ Temp. : 7 d @ 72 °F
  • Hardness : 78 Shore D
  • Material : Thixotropic Paste
  • Odor/Scent : Low
  • Packing Type : Cartridge
  • Physical Form : Paste
  • Tensile Strength : 3,200 psi
  • Type : Adhesive
  • Usage : Structural Bonding
  • Viscosity : Resin: 120,000 cP; Hardener: 75,000 cP
  • Vol. : 400 mL
  • Width : 400mL
  • Working Time : 65 min